Micron Technology has broken ground on a new advanced wafer fabrication facility in Singapore, marking a planned investment of approximately USD 24 billion over the next decade. The facility will be built within Micron’s existing NAND manufacturing complex and is designed to provide up to 700,000 square feet of cleanroom space. Wafer production is scheduled to begin in the second half of 2028, supporting rising demand for NAND memory driven by artificial intelligence and data-intensive applications.
The new plant will become part of Micron’s NAND Center of Excellence in Singapore and will serve as a key node in the company’s global manufacturing network. The site is Singapore’s first double-story wafer fabrication facility and will integrate advanced robotics, AI-enabled manufacturing systems, and smart automation technologies. Co-locating research and development with production is expected to enhance process efficiencies, accelerate technology transitions, and strengthen collaboration across the semiconductor ecosystem.
The expansion will create approximately 1,600 new jobs, adding to the 1,400 roles associated with Micron’s previously announced high-bandwidth memory advanced packaging facility at the same site. In total, the company’s expansion in Singapore is expected to generate around 3,000 jobs focused on engineering and fab operations. The new facility will also incorporate sustainability measures, including greenhouse gas abatement, water recycling, waste circularity, and adherence to LEED standards, reinforcing Singapore’s position as a critical manufacturing hub in the global semiconductor supply chain.
(Source: Micron Technology, Inc.)
